Semiconductor Packaging News2h
Global Semiconductor Sales Increase 20.7% Year-to-Year in November
Global Semiconductor Sales Increase 20.7% Year-to-Year in November: Summary Global semiconductor sales soared to $57.8 billion in November 2024, marking a 20.7% year-over-year sur ...
Semiconductor Packaging News2h
Can Bangladesh become a key player in the global semiconductor industry?
Bangladesh’s semiconductor industry shows promising growth potential, focusing on VLSI design despite lacking large-scale fabrication facilities. With talent, strategic investment, and initiatives ...
Semiconductor Packaging News2h
IFTLE 616: Broadcom eXtreme Dimension System in Package (XDSiP™)
Summary Broadcom unveiled its 3.5D XDSiP™ platform, combining TSMC's CoWoS packaging and 3D silicon stacking for next-gen AI accelerators. Supporting up to 6000mm² SiPs with 12 HBM modules, it targets ...
Semiconductor Packaging News2h
MediaTek, Nvidia to develop new AI chip
Summary MediaTek and Nvidia are collaborating on the GB10 Grace Blackwell superchip for Project Digits, the world’s smallest AI supercomputer. Targeting AI researchers and students, the chip aims to ...
Semiconductor Packaging News2h
Professor Aims to Abate Chipmaking’s ‘Forever Chemicals’
Summary Professor Xiao Su and his team at the University of Illinois have developed a nanofiltration process to remove toxic PFAS chemicals from semiconductor manufacturing. Despite interest from ...
Semiconductor Packaging News2h
Research Bits: Jan. 7
Researchers globally advanced technology with innovative breakthroughs. A Hong Kong-led team developed a groundbreaking aluminum gallium nitride deep-UV microLED display for maskless lithography, ...
Semiconductor Packaging News23h
VIEWPOINT 2025: Dr. Ismail Kashkoush, Chief Technology Officer, JST Manufacturing
The prominent trends we're seeing for 2025 revolve around meeting sustainability demands and keeping equipment cost of ...
Semiconductor Packaging News1d
VIEWPOINT 2025: Brian Schmaltz, Chief Operating Officer, NAMICS Corporation
NAMICS Corporation remains committed to environmental stewardship, dedicated to producing high-quality, eco-friendly ...
Semiconductor Packaging News21h
What's Next For Through-Silicon Vias
Summary Through-silicon vias (TSVs) boost speed and efficiency in 2.5D/3D chip packaging, shrinking devices for AR/VR and biomedical uses. Despite cost hurdles, TSV advancements and backside power ...
Semiconductor Packaging News1d
SIA Welcomes Announcement of New CHIPS for America R&D Facility in Arizona for Semiconductor Prototyping and Advanced Packaging
SIA Welcomes Announcement of New CHIPS for America R&D Facility in Arizona for Semiconductor Prototyping and Advanced Packaging: Summary The Semiconductor Industry Association pra ...
Semiconductor Packaging News1d
SIA Statement on Biden Administration’s Plan to Publish ‘Export Control Framework for Artificial Intelligence Diffusion’
Summary The Semiconductor Industry Association (SIA) criticized the Biden Administration’s proposed AI export controls for their broad scope and lack of industry input, warning they could undermine U.
Semiconductor Packaging News1d
Chip war: Chinese scientists vow to launch breakthrough RISC-V open-source CPU in 2025
Chinese scientists vow to launch breakthrough RISC-V open-source CPU in 2025: Summary China’s top research academy pledged to launch a RISC-V-based processor by 2025, ...