A new technical paper titled “Electron Microscopy-based Automatic Defect Inspection for Semiconductor Manufacturing: A ...

Aware Evaluation and Optimization of 3D IC Architecture with Digital Compute-in-Memory Designs” was published by researchers at Cornell University. “In this paper, we investigate digital CIM (DCIM) ...

D-printed active electronics; edible toothpaste-based transistor; solution deposition for large-scale electronics.

The semiconductor industry increasingly needs more flexible and scalable processor architectures, driving the growing ...

LLMs require a secure environment As with any LLM, a hardware-security oriented program can only generate results as good as ...

Is EDA meant to react to the needs of the industry, or anticipate its needs and develop ahead of the curve? The balance point ...

The number of approaches to process AI inferencing is widening to deal with unique applications and larger and more complex ...

Synopsys 3DIO IP Solution (figure 4) is specially tuned for multi-die heterogeneous integration with a versatile offering, ...

A new technical paper titled “Signal processing architecture for a trustworthy 77GHz MIMO Radar” was published by researchers ...

The shift toward heterogeneous integration and advanced packaging have changed the dynamics of mixed-signal design — and ...

A new technical paper titled “Image Sensors and Photodetectors Based on Low-Carbon Footprint Solution-Processed ...

Early detection of violations: By shifting symmetry checking left in the flow, designers can identify symmetry violations as ...